3D Integration for NoC-based SoC Architectures

3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures.

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

Three-Dimensional Integration of Integrated Circuits - an Introduction. - The Promises and Limitation of 3-D Integration. - Testing 3D Stacked ICs Containing Through-Silicon Vias. - Design and Computer Aided Design of 3DIC. - Physical Analysis of NoC Topologies for 3-D Integrated Systems. - Three-Dimensional Networks-on-Chip: Performance Evaluation. - Asynchronous 3D-NoCs. - Design of Application-Specific 3D Networks-on-Chip Architectures. - 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks. - 3-D NoC on Inductive Wireless Interconnect. - Influence of Stacked 3D Memory/Cache architectures on GPUs.