wissenschaftliche Veröffentlichungen:
Konferenzbeiträge:
2014
P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, "TSV-Annealing : A thermo-mechanical assessment," in Electronics System-Integration Technology Conference (ESTC), 2014, pp. 1-6.
2013
P. Saettler, M. Boettcher, C. Rudolph, and K. J. Wolter, "Bath chemistry and copper overburden as influencing factors of the TSV annealing," in Proceedings - Electronic Components and Technology Conference, 2013, pp. 1753-1758.
P. Saettler, M. Boettcher, and K. J. Wolter, "µ-Raman spectroscopy and FE-analysis of thermo-mechanical stresses in TSV periphery," in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013, 2013, pp. 1-7.
2012
P. Saettler, M. Boettcher, and K. J. Wolter, "Characterization of the annealing behavior for copper-filled TSVs," in Proceedings - Electronic Components and Technology Conference, 2012, pp. 619-624.
P. Saettler, D. Kovalenko, K. Meier, M. Roellig, M. Boettcher, and K. J. Wolter, "Thermo-mechanical characterization and modeling of TSV annealing behavior," in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 2012, pp. 1/6-6/6.
2011
P. Saettler, K. Meier, and K. J. Wolter, "Considering copper anisotropy for advanced TSV-modeling," in Proceedings of the International Spring Seminar on Electronics Technology, 2011, pp. 419-423.
Fachzeitschriften:
2015
P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, "µ-Raman Spectroscopy and FE-Modeling for TSV-Stress-Characterization," Microelectron. Eng. , pp. 1-7, 2015.
2013
P. Saettler, M. Boettcher, C. Rudolph, and K. -J. Wolter, "Thermo-mechanische Charakterisierung des TSV-Annealing," Produktion von Leiterplatten und Syst. , no. 7, pp. 1498-1507, 2013.