MEMS and Nanotechnology, Volume 4 represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.
Inhaltsverzeichnis
Integrated Process Feasibility of Hard-mask for Tight Pitch Interconnects Fabrication. - Thermoelectric Effects in Current Induced Crystallization of Silicon Microstructures. - Evaluation of Resistance Measurement Techniques in Carbon Black and Carbon. - Nano-tubes Reinforced Epoxy. - A Nano-tensile Tester for Creep Studies. - The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing. - New Insight Into Pile-Up in Thin Film Indentation. - Measuring Substrate-independent Young s Modulus of Thin Films. - Analysis of Spherical Indentation of an Elastic Bilayer Using a Modified Perturbation Approach. - Nano-indentation Studies of Polyglactin 910 Monofilament Sutures. - Analytical Approach for the Determination of Nanomechanical Properties for Metals. - Advances in Thin Film Indentation. - Cyclic Nanoindentation Shakedown of Muscovite and its Elastic Modulus Measurement. - Assessment of Digital Holography for 3D-shape Measurement of Micro Deep Drawing Parts in Comparison to Confocal Microscopy. - Full-field Bulge Testing Using Global Digital Image Correlation. - Experimental Investigation of Deformation Mechanisms Present in Ultrafine-grained Metals. - Characterization of a Variation on AFIT's Tunable MEMS Cantilever Array Metamaterial. - MEMS for Real-time Infrared Imaging. - New Insights Into Enhancing Microcantilever MEMS Sensors. - A Miniature MRI-compatible Fiber-optic Force Sensor Utilizing Fabry-Perot Interferometer. - Micromechanical Structure With Stable Linear Positive and Negative Stiffness. - Terahertz Metamaterial Structures Fabricated by PolyMUMPs. - Investigations Into 1D and 2D Metamaterials at Infrared Wavelengths. - MEMS Integrated Metamaterials With Variable Resonance Operating at RF Frequencies. - Creep Measurements in Free-standing Thin Metal Film Micro-cantilever Bending. - MEMS Reliability for Space Applications by Elimination of Potential Failure Modes Through Analysis. - Analysis and Evaluation Methods Associated With theApplication of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies. - Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-based Luminaire. - Direct Determination of Interfacial Traction-separation Relations in Chip-package Systems
